Library

Introduction to microfabrication [electronic resource], electronic bk.

Sami Franssila.

2nd ed.

Chichester, West Sussex, England ; Hoboken, NJ : John Wiley & Sons, 2010.

E-book

Volume No.

electronic bk.

No.	Printing year	Location	Call Number	Material ID	Circulation class	Status	Waiting
1		Online Book	Wiley e-book

Details

Publication year: 2010

Form: 1 online resource (xiv, 518 p.) : ill.

Contents note

Front Matter

Introduction

Micrometrology and Materials Characterization

Simulation of Microfabrication Processes

Silicon

Thin-Film Materials and Processes

Epitaxy

Advanced Thin Films

Pattern Generation

Optical Lithography

Advanced Lithography

Etching

Wafer Cleaning and Surface Preparation

Thermal Oxidation

Diffusion

Ion Implantation

CMP: Chemical-Mechanical Polishing

Bonding

Polymer Microprocessing

Glass Microprocessing

Anisotropic Wet Etching

Deep Reactive Ion Etching

Wafer Engineering

Special Processes and Materials

Serial Microprocessing

Process Integration

MOS Transistor Fabrication

Bipolar Transistors

Multilevel Metallization

Surface Micromachining

MEMS Process Integration

Process Equipment

Equipment for Hot Processes

Vacuum and Plasmas

CVD and Epitaxy Equipment

Cleanrooms

Yield and Reliability

Economics of Microfabrication

Moore's Law and Scaling Trends

Microfabrication at Large

Appendix A: Properties of Silicon

Appendix B: Constants and Conversion Factors

Appendix C: Oxide and Nitride Thickness by Color

Index.

Note

Includes bibliographical references and index.

This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. This second edition includes:. ・      &